PURPOSE: To obtain the subject composite suitable for electrical and electronic material and having high heat resistance, good mechanical characteristics and low of thermal expansion coefficient by combining an inorganic material together with a specific heterocyclic ring-containing polyimide precursor followed by imidizing the combined material.

CONSTITUTION: The objective composite obtained by combining (A) an inorganic material such as metal or ceramics with (B) a heterocyclic ring-containing polyimide precursor having ≥20mol% of the chemical structure unit expressed by formula I [Ar is formula II to formula IV; X is formula V to formula VI (Ar1 is formula II to formula III or formula VII to formula X; Y is O, S or formula XI to formula XII) and imidizing the combined material.