HIGH DENSITY NANOSTRUCTURING INTERCONNECTION

Title:

HIGH DENSITY NANOSTRUCTURING INTERCONNECTION

Document Type and Number:

Japanese Patent JP2005294844

Kind Code:

A

Abstract:

To provide an apparatus and a method for thermally and/or electrically connecting electronic components.

A method and an apparatus for forming an electric and/or heat conductive interconnection are disclosed. In this connection, a first surface and a second surface are brought into contact with each other through a nanostructure arranged on at lest one surface thereof. In an embodiment, there are exemplified a first plurality of regions of nanostructures in a component in an electronic package such as a microprocessor. Then, the first plurality of regions are brought into contact with corresponding a second plurality of regions of nanostructures on a substrate, to cause strong friction coupling. In the other embodiment as exemplification, the plurality of nanostructures are arranged on the component such as a microprocessor, and such nanostructures are brought into contact with the substrate. An intermolecular force permits the application of an attracting force between a molecule of the nanostructure and a molecule of the substrate, thereby establishing coupling between the nanostructure and the substrate.

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Inventors:

BASAVANHALLY NAGESH R
CIRELLI RAYMOND A
LOPEZ OMAR DANIEL

Application Number:

JP2005105721A

Publication Date:

October 20, 2005

Filing Date:

April 01, 2005

Export Citation:

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Assignee:

LUCENT TECHNOLOGIES INC

International Classes:

B82B1/00; B81B7/00; B82B3/00; H01L21/60; H01L21/768; H01L23/485; H01L23/49; H01L23/373; (IPC1-7): H01L21/60; B82B1/00

Domestic Patent References:

JP2006505414A	2006-02-16
JP2006222436A	2006-08-24
JP2004014599A	2004-01-15
JP2003253221A	2003-09-10
JPH04126307A	1992-04-27

Foreign References:

WO2003095190A1

2003-11-20

Attorney, Agent or Firm:

Masao Okabe
Nobuaki Kato
Kazuo
Okabe
Shinichi Usui
Takao Ochi
Teruhisa Motomiya
Asahi Shinmitsu
Katsumi Miyama

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