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Title:
HIGH FREQUENCY PLASMA GENERATING APPARATUS AND METHOD FOR PRODUCING THIN FILM USING THE SAME
Document Type and Number:
Japanese Patent JP2011195909
Kind Code:
A
Abstract:

To provide a high frequency plasma generating apparatus which has simple constitution and generates uniform electric field distribution between electrodes.

The high frequency plasma generating apparatus includes a pair of electrodes comprising a non-grounding electrode and a grounding electrode, a plurality of feeding points provided on the non-grounding electrode, and a power supply means for supplying the high frequency power to the non-grounding electrode from the plurality of feeding points, and generates plasma in a plasma generating area held by the non-grounding electrode and the grounding electrode. In the high frequency plasma generating apparatus, the non-grounding electrode has a square shape, and the plurality of feeding points are provided on an end of the non-grounding electrode at the positions so as to be symmetric to each other with respect to a symmetric plane of the non-grounding electrode.


Inventors:
TAWARA YUKIHIRO
FUKAZAWA TORU
TSUDA MUTSUMI
TAKI MASAKAZU
YONEDA HISAFUMI
Application Number:
JP2010065108A
Publication Date:
October 06, 2011
Filing Date:
March 19, 2010
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C23C16/505; H01L21/205; H05H1/46
Domestic Patent References:
JP2002012977A2002-01-15
JP2006202638A2006-08-03
JP2005285564A2005-10-13
Attorney, Agent or Firm:
Michiharu Soga
Hidetoshi Furukawa
Suzuki Kenchi
Kajinami order
Kazuhiro Oyaku
Shunichi Ueda
Junichiro Yoshida