Title:
HIGH-SPEED THERMOELECTRIC DETECTOR, THERMOELECTRIC SIGNAL COUPLER AND SIGNAL COMMUNICATION METHOD
Document Type and Number:
Japanese Patent JP2001257391
Kind Code:
A
Abstract:
To provide a miniaturized, freely attachable/detachable and low-stress type signal coupler for forming a data communication link between circuit boards or between substrates.
This signal coupler is provided with a transmitting part and a receiving part. The receiving part has a polymer thermoelectric film containing high thermal diffusivity material, such as aluminum nitride with volume percentage of 1% or higher for improving thermal diffusivity. The transmitting part has a thin-film resistant heater for generating heat pulse. The heat pulse is coupled via the membrane of hot grease, which is provided between the receiving part and the transmitting part, to the receiving part.
Inventors:
MORESCO LARRY L
VIVEK MUNSIN
MURASE AKIO
VIVEK MUNSIN
MURASE AKIO
Application Number:
JP2001063848A
Publication Date:
September 21, 2001
Filing Date:
March 07, 2001
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L37/02; G01J5/34; H05K1/02; (IPC1-7): H01L37/02
Attorney, Agent or Firm:
Tadahiko Ito (1 outside)
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