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Title:
極低温装置用高温超電導電流リードアセンブリ
Document Type and Number:
Japanese Patent JP7242749
Kind Code:
B2
Abstract:
A method of manufacturing a lead assembly of a cryogenic system is provided. The method includes developing a three-dimensional (3D) model of a heat exchanger. The heat exchanger includes a plurality of channels extending longitudinally through the heat exchanger from the first end to the second end, the plurality of channels forming a plurality of thermal surfaces within the heat exchanger, the heat exchanger having a transverse cross section. The method further includes modifying the 3D model by at least one of reducing an area of the cross section and increasing the plurality of thermal surfaces. The method also includes additively manufacturing the heat exchanger using an electrically-conductive and thermally-conductive material according to the modified 3D model. Further, the method includes providing a high temperature superconductor (HTS) assembly that includes an HTS strip, and connecting the HTS assembly to the heat exchanger at the second end of the heat exchanger.

Inventors:
Jean-in Lin
Longy Jean
Liyan Ye
Stuart Paul Feltham
Thomas Edward Moran
Ernst Wolfgang Stoutner
Application Number:
JP2021082001A
Publication Date:
March 20, 2023
Filing Date:
May 13, 2021
Export Citation:
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Assignee:
GE Precision Healthcare LLC
International Classes:
H01F6/06
Domestic Patent References:
JP7297025A
JP50118284A
JP59113674A
JP56091411U
JP2016076344A
JP8504300A
JP61002307A
JP2015230981A
JP2019534409A
JP61082487A
JP2207506A
JP2000502842A
JP9069427A
JP63049264U
Attorney, Agent or Firm:
Hiroshi Ogura
Ryoichi Sawaki