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Title:
HONING REAMER AND MACHINING APPARATUS USING THE SAME
Document Type and Number:
Japanese Patent JP2011235429
Kind Code:
A
Abstract:

To solve the following problems: when abrasive grains are planted in the shape of lattice or at random and sufficient intervals are not secured between the abrasive grains, grinding dust, which are produced while grinding using a honing reamer, are sent out just lateral to an advance direction of the reamer in the circumference, so that grinding dust, when viewed microscopically, are occasionally accumulated between diamonds subjected to grinding and diamonds next to the diamonds, resulting in that the grinding dust degrade the grinding performance of the diamond abrasive grains by the interference and the accumulated grinding dust damage the inner surface of a cylinder or the like during grinding.

A honing reamer and machining apparatus using the same is structured such that diamond or borazon abrasive grains with an outer diameter of about 0.2-1.0 mm are planted on the periphery of a cylindrical reamer base material using an adhesive sheet or the like so that line intervals and step intervals may be set to 0.1-2.0 mm with spiral alignment, and that this is tacked on the base and then the diamond or borazon abrasive grains are fixed on the periphery of the reamer base material by brazing or the like.


Inventors:
TAKEZAWA EIJI
Application Number:
JP2010116714A
Publication Date:
November 24, 2011
Filing Date:
April 30, 2010
Export Citation:
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Assignee:
TAKEZAWA SEIKI:KK
International Classes:
B24D7/18; B23D77/00; B24D3/00; B24D3/06
Domestic Patent References:
JP2008119813A2008-05-29
JP2004066435A2004-03-04
JP2004001111A2004-01-08
JP2008119813A2008-05-29



 
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