Title:
ソーカーフからシリコン粒子を回収及び浄化する方法
Document Type and Number:
Japanese Patent JP5539390
Kind Code:
B2
Abstract:
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
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Inventors:
Alexis Grabbe
Tracy M. Reagan
Tracy M. Reagan
Application Number:
JP2011544566A
Publication Date:
July 02, 2014
Filing Date:
December 28, 2009
Export Citation:
Assignee:
MEMC SINGAPORE PTE. LTD.
International Classes:
H01L21/304; B24B27/06; B24B57/00; B28D5/04; B28D7/02; C10M101/02; C10M175/00; C10N30/00; C10N40/22
Domestic Patent References:
| JP8060176A | ||||
| JP2005126535A |
Attorney, Agent or Firm:
Samejima Mutsumi
Kyousei Tamura
Keiichi
Kyousei Tamura
Keiichi