Title:
【発明の名称】半導体製造装置及びそのクリーニング方法
Document Type and Number:
Japanese Patent JP3350590
Kind Code:
B2
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Inventors:
Atsuhiro Tsukine
Kiyokatsu Suzuki
Katsuyoshi Matsuura
Bunken Mieno
Hirokazu Yamanishi
Kiyokatsu Suzuki
Katsuyoshi Matsuura
Bunken Mieno
Hirokazu Yamanishi
Application Number:
JP4133594A
Publication Date:
November 25, 2002
Filing Date:
March 11, 1994
Export Citation:
Assignee:
富士通株式会社
International Classes:
C23C16/44; H01L21/205; H01L21/302; H01L21/3065; H01L21/31; (IPC1-7): H01L21/205; C23C16/44; H01L21/3065
Domestic Patent References:
| JP5243163A | ||||
| JP21116A | ||||
| JP249425A | ||||
| JP6314675A |
Attorney, Agent or Firm:
Keishiro Takahashi