Title:
IC CARD OR THERMOBONDING POLYESTER FILM FOR IC TAG
Document Type and Number:
Japanese Patent JP3968667
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an IC card or a thermobonding polyester film for an IC tag each showing improved thermobonding, unevenness absorbency and slidability while maintaining environmetal adaptability as a plastic material for the IC card or the IC tag (containing no halogen), heat resistance and chemical resistance.
SOLUTION: The thermobonding polyester film for the IC card or the IC tag each obtained by making a thermobonding layer overlie a biaxially stretched polyester film is characterized in that the thermobonding layer is 5 to 30 μm thick, and is composed of a mixture of an amorphous polyester resin A having Tg of 50 to 95°C and a thermoplastic resin B having Tg of -50 to 150°C incompatible with the amorphous polyester resin A, the content of the thermoplastic resin B in the thermobonding layer being 1 to 30 mass%, in that a static friction coefficient between the front and back surfaces of the thermobonding polyester film is 0.1 to 0.8, and in that a forming rate by heat press is 40 to 105% and a slope of the outer margin of the formed part is 20 to 1,000%.
Inventors:
Mutsuo Nishi
Yasushi Sasaki
Yasushi Sasaki
Application Number:
JP2006340963A
Publication Date:
August 29, 2007
Filing Date:
December 19, 2006
Export Citation:
Assignee:
TOYO BOSEKI KABUSHIKI KAISHA
International Classes:
B32B27/36; G06K19/07; G06K19/077
Domestic Patent References:
| JP9085917A | ||||
| JP2003142332A | ||||
| JP2004001888A |
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