Title:
ILLUMINATING DEVICE
Document Type and Number:
Japanese Patent JP2017174720
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve the heat dissipation performance of an illuminating device.SOLUTION: An illuminating device according an embodiment comprises a circuit board, a radiator, and a bonding part. The circuit board comprises a first surface, and a second surface opposed to the first surface, and a light emitting element is mounted on the first surface of the circuit board. The radiator comprises a base plate, is arranged opposite to the second surface of the circuit board, and dissipates heat emitted via the circuit board by the light emitting element. The bonding part includes metal particles, and bonds the second surface of the circuit board and the base plate of the radiator. The bonding part comprises a first region in contact with the second surface of the circuit board, a second region in contact with the base plate of the radiator, and a third region sandwiched between the first region and the second region. The heat conductivities of the first region and the second region are higher than the heat conductivity of the third region.SELECTED DRAWING: Figure 3
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Inventors:
ONO TETSUYA
BETSUDA NOBUHIKO
FUJITA MASAHIRO
BETSUDA NOBUHIKO
FUJITA MASAHIRO
Application Number:
JP2016061754A
Publication Date:
September 28, 2017
Filing Date:
March 25, 2016
Export Citation:
Assignee:
TOSHIBA LIGHTING & TECHNOLOGY
International Classes:
F21V29/503; C09J11/04; C09J201/00; F21V29/76; H05K7/20
Attorney, Agent or Firm:
Sakai International Patent Office