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Title:
INSULATING RESIN COMPOSITION AND PRINTED CIRCUIT SUBSTRATE USING THE SAME
Document Type and Number:
Japanese Patent JP2012007150
Kind Code:
A
Abstract:

To provide an insulating resin composition containing a soluble fluorine-based resin and a printed circuit board manufactured using the same.

The insulating resin composition includes: a soluble fluorine-based resin; a thermosetting resin; and a solvent capable of simultaneously dissolving the soluble fluorine-based resin and the thermosetting resin. In addition, the printed circuit board using the same is disclosed.


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Inventors:
CHO JAE CHOON
JUNG HYUNGMI
LEE CHOON KEUN
Application Number:
JP2011103436A
Publication Date:
January 12, 2012
Filing Date:
May 06, 2011
Export Citation:
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Assignee:
SAMSUNG ELECTRO MECH
International Classes:
C08L101/12; C08K3/00; C08K5/10; C08K5/17; C08L27/16; H05K1/03; H05K3/46
Domestic Patent References:
JPH0272700A1990-03-12
JPH01190734A1989-07-31
JP2009215466A2009-09-24
JPH0711092A1995-01-13
JPS50148898A1975-11-28
JPH0711092A1995-01-13
JPS6459893A1989-03-07
Attorney, Agent or Firm:
Konobu Kato
Takafumi Oshima



 
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