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Title:
INSULATING SHEET, LAMINATED STRUCTURE, AND MANUFACTURING METHOD OF LAMINATED STRUCTURE
Document Type and Number:
Japanese Patent JP2011124078
Kind Code:
A
Abstract:

To provide an insulating sheet and a laminated structure high in handleability at a non-cured state, and capable of restraining warp of a laminated object laminated on a cured object.

The insulating sheet contains a polymer with the weight-average molecular weight of 10,000 or larger and a skeleton derived from glycidyl (meth)acrylate, a curing compound with the weight-average molecular weight of smaller than 10,000 and with an epoxy group or an oxetane group, a curing agent, and a filler. An epoxy equivalent of the polymer is within a range of 200 to 1,000. The laminated structure 1 is provided with a substrate 2 having a first conductive layer 2b at least on one of its faces and either a through-hole or a concave part on one of the faces, insulating layers 3, 4 laminated on one or both faces of the substrate 2 and formed of the insulating sheet, and second conductive layers 5, 8 laminated on a face opposite to the face of the substrate 2 laminated with the insulating layers 3, 4 or a circuit board.


Inventors:
TAKAHASHI RYOSUKE
MAENAKA HIROSHI
AOYAMA TAKUJI
KUSAKA YASUNARI
INOUE TAKANORI
KONDO SHUNSUKE
YAMADA YU
WATANABE TAKASHI
Application Number:
JP2009280332A
Publication Date:
June 23, 2011
Filing Date:
December 10, 2009
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
H01B17/56; B32B7/02; H01L23/12; H01L23/14; H05K1/03; H05K3/46
Attorney, Agent or Firm:
宮▲崎▼ 主税
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