Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
接合部、電子回路基板及び半導体パッケージ
Document Type and Number:
Japanese Patent JP7133739
Kind Code:
B1
Abstract:
【課題】 はんだ接合部と半導体素子との界面における両者の剥離を抑制し得るはんだ合金、はんだ接合材、ソルダペースト及び半導体パッケージの提供。【解決手段】Ｃｕを１．１質量％以上８質量％以下と、Ｓｂを６質量％以上２０質量％以下と、Ｎｉを０．０１質量％以上０．５質量％以下と、Ｃｏを０．００１質量％以上１質量％以下とを含み、残部がＳｎからなる、はんだ合金。【選択図】図１

More Like This:
JP2016073979BALL-SHAPED Au-Sn-Ag BASED SOLDER ALLOY, AND ELECTRONIC COMPONENT ENCAPSULATED USING THE BALL-SHAPED Au-Sn-Ag BASED SOLDER ALLOY AND DEVICE MOUNTED WITH ELECTRONIC COMPONENT
JP2000068410IC PACKAGE SUCH AS BGA OR CSP WITH PLATED BUMPS AT BONDED TERMINALS, USING BONDING MATERIAL IN PLACE OF Pb
JP2003126988SOLDER, SOLDERING METHOD AND SOLDERED JOINT SUBSTRATE
Inventors:
Shoichiro Naruse
Takeshi Nakano
Isao Sakamoto
Toshiaki Shimada
Koichi Okubo
Application Number:
JP2022082674A
Publication Date:
September 08, 2022
Filing Date:
May 20, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TAMURA CORPORATION OF CHINA LIMITED
International Classes:
B23K35/26; B23K35/22; C22C13/02; H05K3/00
Domestic Patent References:
JP2018518368A2018-07-12
Foreign References:
WO2019058650A12019-03-28
WO2019188756A12019-10-03
CN109500510A2019-03-22
KR20190028985A2019-03-20
WO2018193760A12018-10-25
WO2020158660A12020-08-06
Attorney, Agent or Firm:
Yoko Ota



 
Previous Patent: Semi-circular high-strength bolt and method for manufacturing semi-circular high-strength bolt

Next Patent: DIAGNOSTIC DEVICE FOR IDLING CONTROL VALVE