Title:
LAMINATED BODY FOR ELECTROMAGNETIC SHIELD, ELECTROMAGNETIC WAVE SHIELD LAMINATE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2017199934
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a laminated body for electromagnetic shield, which is high in the electromagnetic wave shielding property, the reliability of grounding connection and the reliability of insulation by an insulator layer; an electromagnetic wave shield laminate which is superior in electromagnetic wave shielding property, and of which the miniaturization can be realized by use of the laminated body for electromagnetic shield; an electronic device; and a method for manufacturing the electronic device.SOLUTION: The above problem is solved by a laminated body for electromagnetic shield which comprises a laminate including a conductive adhesive layer (I) and an insulator layer having a through-hole. The conductive adhesive layer (I) includes a binder resin which is softened by heat, and a conductive filler. The insulator layer is 0.001-40% in opening areal rate of the through-hole.SELECTED DRAWING: Figure 1
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Inventors:
HAYASAKA TSUTOMU
Application Number:
JP2017146040A
Publication Date:
November 02, 2017
Filing Date:
July 28, 2017
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD
TOYOCHEM CO LTD
TOYOCHEM CO LTD
International Classes:
H05K9/00; B32B3/24; B32B27/18; H05K1/02
Domestic Patent References:
| JP2017059801A | 2017-03-23 | |||
| JP2012156457A | 2012-08-16 | |||
| JP2015015304A | 2015-01-22 | |||
| JP2004095566A | 2004-03-25 | |||
| JP2003086907A | 2003-03-20 | |||
| JP2011066329A | 2011-03-31 |
Foreign References:
| WO2014010342A1 | 2014-01-16 |