Title:
積層チップバラン素子
Document Type and Number:
Japanese Patent JP5294319
Kind Code:
B2
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Inventors:
Hirofumi Nishizawa
Naoki Okubo
Naoki Okubo
Application Number:
JP2009041466A
Publication Date:
September 18, 2013
Filing Date:
February 24, 2009
Export Citation:
Assignee:
FDK Corporation
International Classes:
H01P5/10; H01F17/00; H01F19/06
Domestic Patent References:
| JP2001144513A |
Foreign References:
| US20030001710 |
Attorney, Agent or Firm:
Shigemi