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Patent Searching and Data


Title:
LARGE CURRENT PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH03227094
Kind Code:
A
Abstract:

PURPOSE: To make a large current printed board small in size by a method wherein a signal current is made to flow through a circuit conductor formed of copper foil, and a power current is made to flow through a circuit conductor which is punched out of a metal plate and bent so as to float except its fixing parts and a through-hole metal piece.

CONSTITUTION: A power circuit conductor 14 which is bent so as to be apart from an insulating board 10 except its fixing parts 16 which are used to fix the conductor 14 to the board 10 and provided with the cylindrically embossed parts, the insulating board 10 provided with positioning holes located corresponding to the embossed parts concerned, and a through-hole metal piece 18 formed in such a manner that a conductive metal plate is formed into the shape of doughnut by punching and the center of it is subjected to a burring processing are provided. The power circuit conductor 14 and the through-hole metal piece 18 inserted into the through-hole of the insulating board 10 for fixing are pressure-joined together by fastening the screws and nuts. By this setup, a power circuit conductor can be formed thick enough, and a circuit board can be formed compact in size.


Inventors:
IMAMURA KAZUHIKO
KARATSU RYOZO
NAKAJIMA YUKIO
Application Number:
JP2038390A
Publication Date:
October 08, 1991
Filing Date:
February 01, 1990
Export Citation:
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Assignee:
FUJI ELECTRIC CO LTD
International Classes:
H05K1/11; H05K1/02; H05K3/20; H05K7/06; (IPC1-7): H05K1/11
Attorney, Agent or Firm:
Haruo Hamada