Title:
PRINTED WIRING BOARD HAVING FINE VIA HOLES AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2015142060
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a printed wiring board and a manufacturing method thereof which can solve the following problems: the difficulty of achieving a smaller via hole diameter by a conformal method for a printed wiring board; and the difficulty of a smaller land diameter by a laser direct method.SOLUTION: A printed wiring board with via holes reduced in diameter is prepared by using, of a laminate board having a copper conductor of a thickness ton at least one surface, the copper conductor as a laser mask, and performing a laser drilling process by a conformal method, thereby forming non-through via holes in the laminate board. The laser mask has openings having an opening diameter φand provided at positions corresponding to layout positions of the non-through via holes to be provided in the laminate board. The laser mask is composed of a copper conductor with a thickness t(t≤t), which is arranged by: making the opening diameter of the laser mask openings smaller (φ) by opening diameter adjustment plating of a thickness tto make the opening diameter φ(φ=φ-2 t<φ); and removing the opening diameter adjustment plating from the surface of the copper conductor except a part on the wall face of each opening.
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Inventors:
ODA SATOSHI
Application Number:
JP2014015060A
Publication Date:
August 03, 2015
Filing Date:
January 30, 2014
Export Citation:
Assignee:
SHINKO SEISAKUSHO LTD
International Classes:
H05K1/11; H05K3/00; H05K3/40
Attorney, Agent or Firm:
Yoshitaka Oshida
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