Title:
PRINTED BOARD
Document Type and Number:
Japanese Patent JPH01187894
Kind Code:
A
Abstract:
PURPOSE:To provide proper solder quantities, enhance a self-alignment effect of the surface tension of solder, reduce the number of interlayer contact holes and jumper wires to improve a mounting density and improve the reliability by a method wherein island parts are formed by etching a copper plate on the surface of a board for mounting a surface mount component on the board and one of the island ports is divided into two or more lands. CONSTITUTION:A land 1 and a land 2 are obtained by dividing one of the lands for mounting a surface mount component 5. A land 3 and a land 4 are obtained in a same way. Wiring patterns 7 run between those lands and a land P and a land Q are connected to each other without interlayer contact holes and jumper wires. As the sizes of the divided lands can be nearly the same as the sizes of lands 8 for the other small component 9, if a quantity of solder applied to one land is determined, proper quantities of solder for all the lands can be obtained. As uniform surface tensions can be applied to the surface mount component 5 by solder on the lands of four corners, it is accurately aligned to the correct direction.
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Inventors:
OGUCHI TOMOHIRO
Application Number:
JP1204288A
Publication Date:
July 27, 1989
Filing Date:
January 22, 1988
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H05K3/34; H05K1/11; H05K3/46; (IPC1-7): H05K3/34
Attorney, Agent or Firm:
Mogami (1 person outside)
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