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Title:
LASER BEAM MACHINING APPARATUS AND LASER BEAM MACHINING METHOD
Document Type and Number:
Japanese Patent JP2010221249
Kind Code:
A
Abstract:

To repair a substrate for a thin film solar cell including a non-machined portion without wasting a cost and a time, and to repair the substrate for the thin film solar cell with a small pitch between thin film blocks.

A laser beam machining apparatus machines a substrate 60 to be machined which is used for a solar cell having a substrate 61 and a thin film 62. The laser beam machining apparatus includes a holding unit 30 for holding the substrate 60, a laser beam oscillator 20 for machining the thin film 62 by applying the laser beam L, a moving mechanism for forming a machining line 65 by relatively moving the position of application of the laser beam L with respect to the thin film 62, and an electric measuring unit 10 for measuring the electric characteristics between a first thin film block 62a1 located on one side of the machining line 65 and a second thin film block 62a2 located on the other side thereof. The electric measuring unit 10 detects any non-machined portion of the thin film 62 by measuring the electric characteristics between the first thin film block 62a1 and the second thin film block 62a2 at a plurality of parts along the machining line 65.


Inventors:
KAWADA YOSHITAKA
Application Number:
JP2009070549A
Publication Date:
October 07, 2010
Filing Date:
March 23, 2009
Export Citation:
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Assignee:
SHIBAURA MECHATRONICS CORP
International Classes:
B23K26/00; B23K26/352; H01L31/04; H01L31/0463; H02S50/10
Domestic Patent References:
JPH04167986A1992-06-16
JPH07260848A1995-10-13
JPH08243775A1996-09-24
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Hiroyuki Ohno