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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING COOLER FOR POWER DEVICE
Document Type and Number:
Japanese Patent JP2010221250
Kind Code:
A
Abstract:

To reduce the warp of a bottom plate 4 in a cooler 1 for a power device.

A cooler bottom plate 4, heat radiation fins 5, a cooler top plate 3, and a substrate for a power device (a DBA substrate) 2 are layered together with a brazing filler metal, and heated and joined by the brazing. In this condition, several recesses 10 having the depth in the direction orthogonal to the bottom surface of the cooler bottom plate 4 are formed in the bottom surface of the cooler bottom plate 4. In a brazing process, a plurality of locking tools 12 supported by a tool base stand 11 are inserted in the plurality of recesses 10 in the depth direction before starting the hardening of a brazed metal to regulate the motion (thermal shrinkage) of the cooler bottom plate 4 in the direction parallel to the bottom surface.


Inventors:
TOMITA YOSHIKI
OTSUKA KENJI
Application Number:
JP2009070661A
Publication Date:
October 07, 2010
Filing Date:
March 23, 2009
Export Citation:
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Assignee:
TOYOTA MOTOR CORP
International Classes:
B23K3/00; B23K1/00; F28F1/18; H01L23/473; B23K101/14; B23K101/40
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Katsuichi Nishimoto
Hiroshi Fukuda