Title:
LASER HEATING METHOD, DEVICE AND LASER HEATING TOOL USED THEREFOR
Document Type and Number:
Japanese Patent JP3256090
Kind Code:
B2
Abstract:
PURPOSE: To provide a high conversion efficiency from electric power to optical intensity as well as a high converging efficiency, to easily control ambient thermal influence, to have a compact size, long life, low device cost and low running cost and to suit laser heating in soldering etc.
CONSTITUTION: A part A to be heated is convergently irradiated and heated by a laser beam L emitted from a semiconductor laser 1 and converged in the shape of a prescribed irradiation spot while using and driving the semiconductor laser 1 for a light emission required for the heating; the semiconductor laser 1 is used plurally combined, enabling radiation directly to the periphery by means of a radiator in contact with the semiconductor laser 1 as it is driven.
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Inventors:
Tsutomu Sakurai
Application Number:
JP18941194A
Publication Date:
February 12, 2002
Filing Date:
August 11, 1994
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
B23K1/005; H01L23/467; H01S3/00; H05K3/34; (IPC1-7): B23K26/06; B23K1/005; B23K26/00; B23K26/14; H01L23/467; H01S3/00; H05K3/34
Domestic Patent References:
| JP3161163A | ||||
| JP61253170A | ||||
| JP2142695A | ||||
| JP7301764A | ||||
| JP6232508A | ||||
| JP7205303A | ||||
| JP2278210A | ||||
| JP6449368U | ||||
| JP362662U |
Attorney, Agent or Firm:
Masaru Ishihara
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