To provide a laser peening method and an apparatus that can improve stress upto approximately 1 mm depth from the surface of a workpiece in a short time.
In the laser peening method, the workpiece 3 is irradiated in the surface continuously with a pulsed laser beam 1 through a liquid 6 and, by relatively moving the workpiece and the laser beam, a tensile residual stress on the surface of the workpiece 3 is reduced or converted to a compressive stress. The laser peening method is characterized in that the stress improvement is performed by guiding, onto the surface of the workpiece with the pulsed laser beam already emitted, a cavitation 7 to be formed by the pulsed laser beam. Also, the laser peening apparatus is equipped with an injection nozzle 8 that jets the liquid coaxially with the laser beam.
COPYRIGHT: (C)2008,JPO&INPIT
Yuji Sano
Yoshiaki Ono
Ayaichi Saeki
| JP2006122969A | ||||
| JP2002346847A |
Masami Tamama
Hidetoshi Tachibana
Yasukazu Sato
Hiroshi Yoshimoto
Yasushi Kawasaki