To make it possible to collectively process multiple points with a single laser without difficulty by enhancing utilization efficiency of irradiation energy of a laser beam.
A laser processing method for irradiating a surface of a silicon substrate 1 coated by an inorganic insulation film 2 with a laser beam to thereby locally removing the insulation film 2, comprises the steps of: irradiating the surface of the substrate 1 with a first laser beam L1, which is in an ultraviolet region and is set at a strength at which at least the surface of the substrate 1 is melted, to thereby melt the surface of the substrate 1; and irradiating a melted part MP of the substrate 1 with a second laser beam L2, which has a wavelength longer than that of the first laser beam L1 and is set at a certain strength, simultaneously with the irradiation with the first laser beam L1 or with a certain delay time from the irradiation with the first laser beam L1 to thereby evaporate a material of the substrate.
| WO/2015/155116 | METHOD AND DEVICE FOR MEASURING POWDER FLOWS OF A LASER WELDING TOOL |
| JP2008100246 | METHOD FOR PRODUCING ELECTROOPTICAL DEVICE |
| JP2010207901 | LASER BEAM MACHINING DEVICE |
YANAGAWA YOSHIKATSU
KIGUCHI TETSUYA
Haruyuki Nishiyama
Shoichi Okuyama
Moriaki Ogawa
Kunio Araki
Taiki Kaji