Title:
LED SUBSTRATE, LIGHT EMITTING DEVICE, AND IMAGE READING DEVICE
Document Type and Number:
Japanese Patent JP2017168492
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an LED substrate that can improve initial warp when an LED is mounted and reduce a mechanical stress on a support base.SOLUTION: There is provided an LED substrate comprising: a long substrate 2002; a first copper pattern 1002 that is arranged on an LED mounting surface of the substrate 2002; a second copper pattern 5001 that is arranged on the opposite side of the LED mounting surface of the substrate 2002; and a plurality of LED chips 2001 that are arranged on the LED mounting surface along the length direction of the substrate 2002, where the occupied area ratio of the second copper pattern 5001 with respect to the area of the substrate 2002 is made smaller than the occupied area ratio of the first copper pattern 1002 with respect to the area of the substrate 2002.SELECTED DRAWING: Figure 5
Inventors:
MIKAMI AKIRA
Application Number:
JP2016049489A
Publication Date:
September 21, 2017
Filing Date:
March 14, 2016
Export Citation:
Assignee:
CANON KK
International Classes:
H01L33/62; H01L33/00
Attorney, Agent or Firm:
Another role Shigehisa