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Title:
LIGHT-EMITTING DIODE ASSEMBLY
Document Type and Number:
Japanese Patent JP2012074132
Kind Code:
A
Abstract:

To provide an LED assembly 140 whose width can be reduced without enlarging a thickness of a liquid crystal display, as well as the liquid crystal display 10 with such an LED assembly 140 as a component.

A printed circuit board 150, of a long and narrow plate shape, is provided with a reception part 151 extended toward a long-side center. The reception part 151 is of a rectangular shape, and is integrated with the printed circuit board 150. LED elements 141 are arranged in a length direction of one side face of the printed circuit board 150. Connectors 161 are mounted on the reception part 151 at the other side face. A width of the reception part 151 is wide enough to arrange a plurality of contacts C in a lateral direction. A bottom face of a bottom chassis 190 has holes 192 bored at two points of a backlight assembly 120 corresponding to the reception part 151, so that a rear face of the bottom chassis 190 is not bulky. Such measures are taken that the holes 192 are to be covered with a dustproof cover 191 so as to prevent foreign substances from infiltrating, or a convex part is provided at a shape itself of the bottom chassis 190.


Inventors:
WATANABE SATORU
MIYAZONO KATSUNORI
Application Number:
JP2010208312A
Publication Date:
April 12, 2012
Filing Date:
September 16, 2010
Export Citation:
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Assignee:
J S T MFG CO LTD
International Classes:
F21S2/00; F21V19/00; F21V23/06; G02F1/1333; G02F1/13357; H01L33/48; F21Y101/02
Domestic Patent References:
JP2002075038A2002-03-15
JP2008198398A2008-08-28
JP2005038768A2005-02-10