Title:
発光モジュールの製造方法及び発光モジュール
Document Type and Number:
Japanese Patent JP6790899
Kind Code:
B2
Abstract:
A light emitting module with a reduced thickness is provided. A method of manufacturing a light emitting module sequentially includes:
providing a light guiding plate having a first main surface being a light emitting surface, and a second main surface on the side opposite to the first main surface; providing a plurality of light emitting elements on the light guiding plate; and forming a wiring electrically connecting the plurality of light emitting elements. A light emitting module includes: a light guiding plate having a first main surface and a second main surface; a plurality of wavelength conversion parts disposed at the second main surface of the light guiding plate so as to be spaced apart from each other; a plurality of light emitting elements respectively bonded to the plurality of wavelength conversion parts;
and a wiring connected to the plurality of light emitting elements.
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Inventors:
Tadao Hayashi
Application Number:
JP2017028053A
Publication Date:
November 25, 2020
Filing Date:
February 17, 2017
Export Citation:
Assignee:
Nichia Corporation
International Classes:
F21S2/00; F21V8/00; F21V9/32; F21V23/00; G02F1/13357; H01L33/50; H01L33/62
Domestic Patent References:
| JP2010164976A | ||||
| JP2009193955A | ||||
| JP2008059786A | ||||
| JP2007042320A | ||||
| JP2005038776A |
Foreign References:
| US20120293979 |
Attorney, Agent or Firm:
Samejima Mutsumi
Keiichi
Keiichi