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Title:
LIQUEFACTION PREVENTIVE STRUCTURE OF SUBSTRUCTURAL GROUND
Document Type and Number:
Japanese Patent JP2819902
Kind Code:
B2
Abstract:

PURPOSE: To improve the ground effectively by dispersing water-swelling fibers in water to prepare an injection material, injecting it from an injecting pipe into the ground easy to liquefy, allowing it to absorb the water contained in the ground without risk of diffusion and to swell and gel.
CONSTITUTION: By the one-shot injection system, an injection material prepared by dispersing water-swelling fibers in water is injected from an injecting pipe in a specified place of the ground E which is easy to liquefy at the time of earthquake, and thereby a substructural ground E1 is constructed. Otherwise, injection is made in lattice form with the aid of steel material for building a shutoff wall, and thereby a substructural ground E1 is constructed. Further an electrolyte for adjusting the swell and gellation time is added to the injection material. Thereby the injection material injected in the ground E is allowed to absorb water contained in the ground, swell, and get without risk of diffusion or dilution with the underground water before solidification. This permits constructing the substructural ground E1 with good effectiveness and less risk of ground contamination.


Inventors:
Katsumi Otani
Masatoshi Kushima
Fujio Ito
Application Number:
JP33292891A
Publication Date:
November 05, 1998
Filing Date:
November 22, 1991
Export Citation:
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Assignee:
Obayashi Corporation
International Classes:
E02D3/12; E02D19/16; (IPC1-7): E02D3/12; E02D19/16
Domestic Patent References:
JP1142119A
JP3244711A
JP5810508B2
Other References:
増田房義著 「高分子新素材OnePoint4 高吸収性ポリマー」 第1版,共立出版,昭和62年11月15日発行,P.22−23
Attorney, Agent or Firm:
Kensuke Isshiki (2 outside)