To provide a low-dielectric electronic material having an excellent low-dielectric property with processability required for an electronic material, a sheet and laminated board composed of the material, and a production method of a polyarylate having the low-dielectric property used as the material.
The low-dielectric electronic material comprises the polyarylate which consists of a residue of a dicarboxylic acid such as isophthalic acid and a residue of a dihydric phenol having a fluorene structure without having a bisphenol structure and/or an alkyl group and has a dielectric coefficient of below 2.0×10-3 at 1 GHz. The production method of the same, a resin composition for an electronic material comprising the polyarylate and a thermosetting resin such as an epoxy resin with a compound having an active ester group as a curing agent, the low-dielectric electric materials comprising these resin compositions for an electric material and the sheet and laminated board comprising these low-dielectric electronic materials, are provided.
| JP2005055575 | OPTICAL FILM |
| JP2012077176 | INSULATION FILM, LAMINATED BODY, AND SEMICONDUCTOR DEVICE |
KUWANA YASUHIRO
YAMADA MASAO
SANTO YOSHINARI
USAMI SUKEAKI
| JPH11209687A | 1999-08-03 | |||
| JP2000243144A | 2000-09-08 |
| WO1999018141A1 | 1999-04-15 |