Title:
MANUFACTURE OF PACKAGE FOR SOLID-STATE IMAGE PICKUP ELEMENT
Document Type and Number:
Japanese Patent JPH06310694
Kind Code:
A
Abstract:
PURPOSE: To provide the manufacture of a package for a solid-state image pickup element in which the workability of applying a sealing medium to a transparent cover body can be made satisfactory and an accurate photoelectric conversion can be generated in a solid-state image pickup element.
CONSTITUTION: First, a transparent flat plate 9 with large area is prepared and stuck on a support film 10; subsequently, the transparent flat plate 9 with large area on the support film 10 is cut and divided into a plurality of transparent cover bodies 2; and then, paste 8a becoming a sealing medium 8 is printed on and applied to respective transparent cover bodies 2 on the support film 10 and dried thereafter.
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Inventors:
FURUKAWA MASAJI
Application Number:
JP10134093A
Publication Date:
November 04, 1994
Filing Date:
April 27, 1993
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L23/02; H01L27/14; (IPC1-7): H01L27/14; H01L23/02