PURPOSE: To solve problems such as heat transmission, heat dissipating properties, and the like so as to improve a semiconductor mounting board in connection reliability by a method wherein a semiconductor chip can be directly connected to a metal part, where the area ratio of the metal part to the whole face is made large and moreover the metal part in contact with outside air is made large in area.
CONSTITUTION: A pin inserting hole 6' is bored in the center of an electrically insulating resin composition 3 buried in a hole 6 formed in a metal board so as not to reach to the metal part of the base of the hole 6, and in succession a required pattern 8' is formed on the copper foil of the metal board 1. Then, the side of the metal board 1 where the circuit pattern 8' has been formed is spot-faced as deep as nearly half the thickness of the board 1 to form a semiconductor mounting recess 9, and moreover the semiconductor mounting recess 9 and the opposite side of the board 1 are plated with nickel.gold, whereby a semiconductor mounting board is obtained. By this setup, a semiconductor mounting board excellent in heat dissipating property can be obtained, whereby problems such as the reduction of a semiconductor chip in capacity with the increase of the semiconductor chip in heat release value and the reduction of connection in reliability can be solved.
ENDO TOSHINAGA
MATSUI YASUO
