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Title:
MANUFACTURE OF SUSPENSION WITH CIRCUIT WIRING FOR MAGNETIC HEAD
Document Type and Number:
Japanese Patent JP3727410
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide the method for efficiently manufacturing the suspension with circuit wiring for a magnetic head in constituting the suspension integrally with a leader wiring member in a magnetic head element.
SOLUTION: One side surface of a plate-like flexible insulating base material 2 is provided with an electrically conductive layer, while the other side surface is provided with a laminated plate having a metallic layer of a spring property, and photoetching processing is performed on this laminated plate to the electrically conductive layer to form a metal mask in a required base member shape, and the flexible insulating base material is removed in its exposed parts leaving at least a thickness without exposing the matallic layer of the spring property, and then photoetching processing is performed on the metal mask to form a required circuit wiring pattern. Then, by using this circuit pattern as an etching mask, the remaining flexible insulating base material on the surface of the metallic layer of the spring property is moved to form a surface protecting layer 4 on the surface of the circuit wiring pattern. Subsequently, photoetching processing and prescribed bending and forming work are performed on the metallic layer of the spring property to form the suspension in a desired shape.


Inventors:
Masakazu Inaba
Application Number:
JP11899896A
Publication Date:
December 14, 2005
Filing Date:
May 14, 1996
Export Citation:
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Assignee:
Nippon Mektron Co., Ltd.
International Classes:
G11B5/60; G11B5/48; G11B21/02; G11B21/21; H05K3/44; H05K1/05; H05K3/00; H05K3/28; (IPC1-7): G11B5/60; G11B21/21
Domestic Patent References:
JP8030946A
JP8036721A
JP8045213A
Attorney, Agent or Firm:
Kazuo Sato
Masamitsu Sato
Masami Tamama
Hidetoshi Tachibana