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Title:
MANUFACTURING METHOD OF MOLDING MATERIAL AND MANUFACTURING METHOD OF MOLDING
Document Type and Number:
Japanese Patent JP2002179924
Kind Code:
A
Abstract:

To provide a manufacturing method of a molding material and of a molding having both excellent conductivity and moldability (flowability, ease of molding, or the like upon molding).

The manufacturing method of the molding material comprises sticking a treating agent to a surface of a conductive material to obtain a composite conductive material, and mixing the composite conductive material with a resin, the resin being selected so that when the treating agent of 0.5-3 wt.% and the resin of 97-99.5 wt.% are mixed, they are not compatible with each other, and the resin has a nature in which the treating agent is coated by the resin to constitute a sea/an island structure. The manufacturing method of the molding comprises molding using the molding material.


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Inventors:
WADAHARA EISUKE
ISHIBASHI SOICHI
TSUCHIYA ATSUKI
Application Number:
JP2000376381A
Publication Date:
June 26, 2002
Filing Date:
December 11, 2000
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
C08J5/00; B29C45/00; C08K3/00; C08K5/00; C08K9/04; C08L101/00; (IPC1-7): C08L101/00; B29C45/00; C08J5/00; C08K3/00; C08K5/00; C08K9/04



 
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