Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP5625431
Kind Code:
B2
Inventors:
村山 竜一
奥村 高拡
奥村 高拡
Application Number:
JP2010070999A
Publication Date:
November 19, 2014
Filing Date:
March 25, 2010
Export Citation:
Assignee:
住友ベークライト株式会社
International Classes:
H01L21/52; C09J109/00; C09J163/00; C09J167/00; C09J179/04; C09J201/02; C09J201/06
Previous Patent: 半導体用接着剤および半導体装置
Next Patent: AUTOMATIC DROPPING DEVICE FOR PRODUCT IN INJECTION MOLDING MACHINE
Next Patent: AUTOMATIC DROPPING DEVICE FOR PRODUCT IN INJECTION MOLDING MACHINE