Title:
固体撮像装置の製造方法
Document Type and Number:
Japanese Patent JP5422914
Kind Code:
B2
Abstract:
A method of manufacturing a solid-state imaging device, where a signal circuit is formed on an insulating interlayer on a first side of a semiconductor substrate in which a photoelectric conversion part is formed and light is incident on the photoelectric conversion part from a second side thereof. The method includes the steps of: forming an on-chip color filter and an on-chip microlens on the second side where light is incident; and forming an opening in a pad part on the second side where light is incident.
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Inventors:
Kentaro Akiyama
Application Number:
JP2008125189A
Publication Date:
February 19, 2014
Filing Date:
May 12, 2008
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L27/14; H04N5/335; H04N5/365; H04N5/369; H04N5/3745
Domestic Patent References:
| JP2005347707A | ||||
| JP2005353631A | ||||
| JP2003229551A | ||||
| JP2006351761A | ||||
| JP6302794A | ||||
| JP2002176156A |
Attorney, Agent or Firm:
Yoshitsuno Kakuda
Hitoshi Ito
Hitoshi Ito