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Title:
MANUFACTURING METHOD OF THERMOSETTING RESIN FRAME OF LIGHT-EMITTING DIODE
Document Type and Number:
Japanese Patent JP2013038254
Kind Code:
A
Abstract:

To provide a manufacturing method of a thermosetting resin frame of a light-emitting diode, capable of improving production efficiency and a production quantity, by adopting a roll type manufacturing method for a manufacturing method of a thermosetting resin frame of a light-emitting diode to automate production of a thermosetting resin frame of a light-emitting diode, saving manpower, and reducing manufacturing time to remarkably reduce manufacturing cost.

A plurality of base is formed after processes of: preparing a roll type metallic material; processing the metallic material with press punching or etching; forming a frame strip having a mounting part; applying plating treatment to the frame strip; inserting the frame strip completed with the plating treatment into a metal mold; and resin-sealing with a thermosetting resin. Then, the frame strip on which the bases are formed by resin-sealing at the mounting part is carried in an oven, and the frame strip is cut into sheet pieces after baking. Finally, the sheet pieces are inspected and if there is no defect in the inspection of the sheet pieces, a shipment is carried out.


Inventors:
CHU CHUNFONG
CHEN YUAN FU
Application Number:
JP2011173802A
Publication Date:
February 21, 2013
Filing Date:
August 09, 2011
Export Citation:
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Assignee:
FUSHENG IND CO LTD
International Classes:
H01L33/62
Domestic Patent References:
JP2000261040A2000-09-22
JP2009049197A2009-03-05
JP2007214522A2007-08-23
JP2009206370A2009-09-10
JP2010062272A2010-03-18
JPH11238908A1999-08-31
Attorney, Agent or Firm:
▲吉▼川 俊雄