Title:
METHOD FOR MANUFACTURING TRANSPARENT SUBSTRATE
Document Type and Number:
Japanese Patent JP2022053990
Kind Code:
A
Abstract:
To provide a method for manufacturing a transparent substrate having good non-visibility between a low resistance part (conductive part) and a high resistance part (non-conductive part).SOLUTION: A method for manufacturing a transparent substrate includes: a first printing step of printing an undercoat layer 18 in a solid state onto a whole area of at least one main surface of a transparent substrate 10; a second printing step of printing a conductive fiber-containing layer 16 that contains conductive fibers nearly uniformly dispersed in plan view and a binder resin and has increased resistance by the undercoat layer 18, in a solid state, onto the undercoat layer 18; an etching step of etching a binder resin constituting a conductive fiber-containing layer 16 into a desired pattern in plan view, in which the transparent substrate has a high resistance part with a surface resistance value RH where the binder resin constituting the conductive fiber-containing layer 16 is not etched and a low resistance part with a surface resistance value RL where the binder resin is etched, RH/RL>100, and the undercoat layer contains a resin having at least one of a group having (-NH-) and a junction part.SELECTED DRAWING: Figure 1
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Inventors:
TOBA MASAHIKO
Application Number:
JP2020160925A
Publication Date:
April 06, 2022
Filing Date:
September 25, 2020
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
H01B13/00; G02F1/1343
Attorney, Agent or Firm:
Genji Aihara
Takei Nobutori
Takei Nobutori