To provide a marking device and a marking method capable of successively and accurately marking a large amount of products (workpieces) in a short period of time without using a mechanical positioning means (correcting means), such as correction claws, in order to improve production efficiency.
A workpiece W conveyed to a workpiece marking position B is marked by a laser marker 2. Workpiece position information is detected at a workpiece detecting position A in the upstream side of the workpiece marking position B. Based on the workpiece position information, which is transmitted to a control means 3 while the workpiece is conveyed from the workpiece detecting position A to the workpiece marking position B, the workpiece W is conveyed to the workpiece marking position, and marking is immediately conducted on the workpiece at the regular position by controlling the laser marker 2.
| JPH11156566A | 1999-06-15 | |||
| JP2005219102A | 2005-08-18 | |||
| JPH05121573A | 1993-05-18 | |||
| JP2000263475A | 2000-09-26 | |||
| JP2001015622A | 2001-01-19 | |||
| JP2002046085A | 2002-02-12 | |||
| JP2004074217A | 2004-03-11 | |||
| JP2006303080A | 2006-11-02 |
| WO2004105110A1 | 2004-12-02 |
Hideka Tanaka
Yoshiyuki Shiraishi
Kunihiko Shiromura
Tsuyoshi Kumano