Title:
マスクの形成方法、これを利用したプリント配線基板の製造方法、電鋳部品の製造方法およびスクリーン印刷製版の製造方法
Document Type and Number:
Japanese Patent JP6829859
Kind Code:
B2
Abstract:
[Problem] The present invention provides: a method for forming a mask with which it is possible to easily and reliably form a resin layer on the surface of a base layer in a closely bonded state; and a method for manufacturing a printed wiring board, a method for manufacturing an electroformed component, and a method for manufacturing a screen printing plate that use the method for forming a mask. [Solution] An acid aqueous solution 30 containing an undercoat-layer-forming agent is brought into contact with the surface of a base layer 2, an oxide film on the surface of the base layer 2 is removed, and the surface of the base layer 2 exposed thereby is activated. This method for forming a mask 10 includes: a step for forming an undercoat layer 3 derived from the undercoat-layer-forming agent on the activated surface; a step for providing an ultraviolet-curable resin layer 1 on the surface of the undercoat layer 3 to thereby closely bond the resin layer 1 to the surface of the base layer 2 with the undercoat layer 3 interposed therebetween, and forming an ultraviolet-curable-type mask layer 31 comprising the undercoat layer 3 and the resin layer 1; and a step for irradiating the mask layer 31 with ultraviolet rays to thereby cure the irradiated portion, and removing an uncured mask layer to thereby form a hardened mask 10. Also provided are a method for manufacturing a printed wiring board, a method for manufacturing an electroformed component, and a method for manufacturing a screen printing plate using this method for forming a mask.
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Inventors:
Hideyuki Moriya
Keiichiro Moriya
Moriie, Hiroaki
Keiichiro Moriya
Moriie, Hiroaki
Application Number:
JP2016082149A
Publication Date:
February 17, 2021
Filing Date:
April 15, 2016
Export Citation:
Assignee:
Hokuriku Filtration Co., Ltd.
International Classes:
G03F7/16; B41C1/14; B41N1/24; C23F1/00; C25D1/20; G03F7/004; G03F7/11; G03F7/12; H05K3/06; H05K3/18
Domestic Patent References:
| JP2012237064A | ||||
| JP2006235499A | ||||
| JP2004058640A | ||||
| JP2007334058A | ||||
| JP2009154517A | ||||
| JP2014051575A | ||||
| JP2005039097A | ||||
| JP2006156605A |
Attorney, Agent or Firm:
Toshiro Takashima
Ogawa Taizhou
Ogawa Taizhou