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Title:
銅合金から製造した導電線のための材料
Document Type and Number:
Japanese Patent JP2008506040
Kind Code:
A
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JPS59232244SOFTENING RESISTANT COPPER ALLOY HAVING HIGH CONDUCTIVITY
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JP5722427Copper-titanium alloy sputtering target, semiconductor wiring formed by using the sputtering target, and semiconductor elements and devices provided with the same semiconductor wiring.
Inventors:
Oslivan, Michael
Wilhartits, Peter
Reichtfleet, Gerhard
Application Number:
JP2007520614A
Publication Date:
February 28, 2008
Filing Date:
July 11, 2005
Export Citation:
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Assignee:
Plansee SA
International Classes:
C22C9/00; C22C9/10; C23C14/34; H01B1/02; H01L23/498; H01L23/532; C22C1/04
Domestic Patent References:
JP2002069550A2002-03-08
JPH05271828A1993-10-19
JPH0762471A1995-03-07
JPH10509559A1998-09-14
JP2005220384A2005-08-18
JPH1150242A1999-02-23
JP2004076080A2004-03-11
JPH07252648A1995-10-03
JP2005113259A2005-04-28
JP2001011610A2001-01-16
JPH1180861A1999-03-26
JPH1150242A1999-02-23
JP2004076080A2004-03-11
JPH07252648A1995-10-03
JP2005113259A2005-04-28
JP2001011610A2001-01-16
JPH1180861A1999-03-26
JP2000034562A2000-02-02
JP2003338465A2003-11-28
Attorney, Agent or Firm:
Iwao Yamaguchi



 
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