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Title:
MATERIAL FOR SLIP RING
Document Type and Number:
Japanese Patent JPS6075539
Kind Code:
A
Abstract:

PURPOSE: To obtain a material for slip ring of a slip ring assembly having high hardness and improved resistance to adhesion by incorporating a specified proportion of Cu to Au.

CONSTITUTION: A material for slip ring comprising Au contg. 5W15wt% Cu is provided. A slip ring 1' of a slip ring assembly 3' used for electrical coupling of a rotary shaft and a stationary shaft is constituted of the material. A Cu lead wire 4 having insulating film is welded to the inside peripheral surface of the ring 1'. Five rings 1' are molded integrally with epoxy resin 6 at a specified interval to a metallic supporting shaft 5 to prepare a vertical assembly 3' having the lead wire 4 led to the base end 5 of the shaft. When a brush contact 9 prepd. by welding five lines of brush wire 7 bundled in parallel to a base material 8 is allowed to contact with the ring 1' of the assembly 3' and is slid by rotation, the hardness of the ring 1' is high, with remarkably little abrasion and low noise.


Inventors:
YOSHIDA HIROSHI
Application Number:
JP18153683A
Publication Date:
April 27, 1985
Filing Date:
September 29, 1983
Export Citation:
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Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
C22C5/02; H01B1/02; (IPC1-7): C22C5/02; H01B1/02
Domestic Patent References:
JPS50137821A1975-11-01
JPS52133021A1977-11-08



 
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