Title:
METAL PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2007260940
Kind Code:
A
Abstract:
To provide a forming method of high productivity for a metal pattern hard to cause the thickening of a dotted line or a fine line even in the case that plating is applied to the surface of an extremely thin silver film and not showing a copper color in a color phase when looked from its back.
In this metal pattern forming method, a plating layer with a thickness of 1 μm or smaller is formed on the surface of the silver thin film pattern formed on a support using a neutral or basic copper plating bath and electroplating for a thickness increase is further applied to the surface of the plating layer.
COPYRIGHT: (C)2008,JPO&INPIT
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Inventors:
KOBAYASHI KAZUHISA
Application Number:
JP2006085446A
Publication Date:
October 11, 2007
Filing Date:
March 27, 2006
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD
International Classes:
B32B15/08; H05K9/00
Domestic Patent References:
JP2004221564A | 2004-08-05 | |||
JPH11145757A | 1999-05-28 |