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Title:
METALLIC NANOPARTICLE DISPERSION AND METALLIC FILM
Document Type and Number:
Japanese Patent JP2008069374
Kind Code:
A
Abstract:

To provide a metallic nanoparticle dispersion from which a metallic film having excellent adhesion to a substrate can be formed by performing application to the substrate and baking and also to provide a metallic film having excellent adhesion to a substrate, which can be obtained by applying the metallic nanoparticle dispersion to the substrate and carrying out baking.

The metallic nanoparticle dispersion contains metallic nanoparticles of 1 to 100 nm average particle size and at least one metal selected from Bi, Mo, Mn, Fe, Zn, In, Sn, Zr, La and Ce, preferably in the form of organic acid salt.


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Inventors:
ONO HIRONOBU
HASHIMOTO TAKAAKI
OKUNO MASAAKI
Application Number:
JP2006246379A
Publication Date:
March 27, 2008
Filing Date:
September 12, 2006
Export Citation:
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Assignee:
NIPPON CATALYTIC CHEM IND
International Classes:
B22F9/00; B22F1/0545; B22F3/10; C22C5/06; C22C9/00; C22C9/02; C22C9/04; C22C9/05; H01B1/22; H01B5/14
Domestic Patent References:
JP2004263222A2004-09-24
JPS6286602A1987-04-21
Foreign References:
WO2006011180A12006-02-02



 
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