Title:
METHOD AND APPARATUS FOR MEASURING HEIGHT
Document Type and Number:
Japanese Patent JP3922608
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To greatly improve the cycle time to enable the accurate height measurement, by obtaining the height of a protrusion from a taken image of the protrusion, differentiating it to extract height data of a flat part from the differentiated value.
SOLUTION: An object to be measured is made to be a printed cream solder on a wiring board. A laser light from a laser diode 1 is collimated by a collimating lens 2 into a parallel beams 1a, restricted by a focus lens 3 into a spot beam, reflected at 45° to the incident angle by a projection mirror 4, and drawn in one direction by a line generator 5 into a line beam of 14 μm wide, 10 mm long on the object 11 which is then photographed by a CCD camera 6, variously processed image data is sent to a center of gravity position processing block to compute the center of gravitational value and stored in a memory as a height data, the read height data is differentiated to obtain the height of a flat part and the cream solder height is obtd. from the flat part as a reference.
Inventors:
Mitsumasa Okabayashi
Sumio Goto
Masaru Saito
Sumio Goto
Masaru Saito
Application Number:
JP4846298A
Publication Date:
May 30, 2007
Filing Date:
March 02, 1998
Export Citation:
Assignee:
JUKI Corporation
International Classes:
G01B11/02; H05K3/34; (IPC1-7): G01B11/02; //H05K3/34
Domestic Patent References:
JP3188307A | ||||
JP5256618A | ||||
JP5166904A |
Attorney, Agent or Firm:
Satoshi Takaya
Keisuke Matsuyama
Tsuyoshi Makino
Taku Kato
Keisuke Matsuyama
Tsuyoshi Makino
Taku Kato
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