Title:
METHOD OF APPLYING THERMOPLASTIC RESIN TO NON-HEAT RESISTING FILM AND DEVICE FOR EXECUTING THE METHOD
Document Type and Number:
Japanese Patent JP3329499
Kind Code:
B2
Abstract:
PURPOSE: To apply thermoplastic resin to a non-heat resisting film not subjected to any special treatment without fusion and shrinkage by applying fused thermoplastic resin at designated spaces on the separation treated transport surface, moving and transporting the same while cooling, and transferring the same to a non-heat resisting film.
CONSTITUTION: The surface of a rotor in a driving part 1 forms a transport surface 3, and a liquid circulating pipe 8 is connected to a cavity 5 provided in the interior to form a temperature control means for the transport surface 3. An application part 2 applies fused thermoplastic resin 6 at designated spaces on the transport surface 3, and as a non-heat resisting film, a continuous sheet 7 of a packing material for a sanitary napkin is moved with the rotation of the driving part 1. In this case, the transport surface 3 is smooth and subjected to release finishing, and the applied thermoplastic resin 6 is cooled by the movement of the transport surface 3 and transported to be transferred to the continuous sheet 7 as a non-heat resisting film. A sanitary napkin 21 is placed thereon and wrapped from both sides by the continuous sheet 7, and thereafter.
More Like This:
JP4792182 | Disposable absorbent goods |
WO/2012/132488 | ABSORBENT ARTICLE |
JP7212985 | Articulated disposable wearing article |
Inventors:
Satoshi Yamamoto
Hikotaro Kawaguchi
Hikotaro Kawaguchi
Application Number:
JP33073692A
Publication Date:
September 30, 2002
Filing Date:
December 10, 1992
Export Citation:
Assignee:
Kao Corporation
International Classes:
A61F13/56; A61L15/00; B05C1/02; B05D7/24; (IPC1-7): B05C1/02; A61F13/56; B05D7/24
Domestic Patent References:
JP61228077A | ||||
JP283058A | ||||
JP4987194A | ||||
JP51148288A | ||||
JP5855825B1 |
Attorney, Agent or Firm:
Osamu Hatori
Previous Patent: BUILDING BLOCK TYPE ELECTRONIC APPARATUS
Next Patent: BIODEGRADABLE RESIN COMPOSITION
Next Patent: BIODEGRADABLE RESIN COMPOSITION