PURPOSE: To firmly bond an electrically conductive substrate to a specific insulator at a low temperature with a high accuracy by carrying out ion implanting of ionic species into an electrically conductive thin film formed on the surface of the specific insulator, forming an insulating thin film thereon and anodically joining the insulator through the insulating thin film and the electrically conductive thin film to an electrically conductive substrate.
CONSTITUTION: An electrically conductive thin film 2 having 0.01-2.0μm thickness is formed on the surface of an insulator 1 of ceramics or a polymer (composite) not containing mobile ions according to a chemical vapor deposition(CVD), a sputtering method, etc. Ionic species such as B ions, P ions or As ions are then subjected to the ion implantation from the side of the thin film 2 to strengthen the adhesiveness between the insulator 1 and the thin film 2. An insulating thin film 4 having 0.02-2.0μm thickness is subsequently formed on he thin film 2 according to the CVD, sputtering method, etc. The resultant thin film 4 and the electrically conductive substrate 3 are mutually opposed and superposed. In this state of the thin film 4 and the electrically conductive substrate 3, a voltage is then applied across the thin film 2 and the substrate 3 while heating both to carry out the anodic joining.
AKAIKE MASATAKE
FUSHIMI MASAHIRO
YAGI TAKAYUKI
