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Title:
METHOD AND DEVICE FOR FORMING THIN FILM
Document Type and Number:
Japanese Patent JPS6017070
Kind Code:
A
Abstract:

PURPOSE: To form a thin film contg. a material which is difficult to be supplied as a target by a sputtering method by forming the material which is difficult to be vacuum-evaporated to a thin film by a sputtering method and the material which is difficult to be manufactured into a target into a thin film by a vacuum deposition method.

CONSTITUTION: A thin film is formed on a substrate 38 by carring out simultaneously or alternately a stage for forming a sputtered thin film in which the thin film is formed by driving off target-constituting atoms from the surface of a target 36 by the bombardment of high energy ion in a vacuum vessel 31 and depositing the atoms on the surface of the substrate 38 and a stage for forming a vacuum-deposited thin film in which the thin film is stuck and formed on the surface of the substrate 38 by disposing an evaporating source 34 contg. a material 37 for vapor deposition in the same vessel 31 and evaporating the material 37 by heating, thereby depositing the same on the substrate.


Inventors:
SERIKAWA TADASHI
OKAMOTO AKIO
Application Number:
JP12486283A
Publication Date:
January 28, 1985
Filing Date:
July 11, 1983
Export Citation:
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Assignee:
NIPPON TELEGRAPH & TELEPHONE
International Classes:
C23C14/24; C23C14/22; (IPC1-7): C23C14/22
Domestic Patent References:
JPS57188676A1982-11-19
JPS58177463A1983-10-18
JPS59134821A1984-08-02
Attorney, Agent or Firm:
Takashi Sawai