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Patent Searching and Data


Title:
METHOD FOR FORMING BOND COAT AND THERMALLY INSULATING FILM ON METALLIC BASE MATERIAL AND RELATED ARTICLE
Document Type and Number:
Japanese Patent JP2001179431
Kind Code:
A
Abstract:

To provide a novel method which efficiently applies a bond coat and TBC to a hardly accessible region of a base material.

The method for forming at least one layer of the bond coat on the surface of the metallic base material is provided. The foil of the bond coat material is first mounted on the base material surface and is then welded to the base material surface by brazing or the like. In many cases, the bond coat is formed by first thermally spraying a bond coat material to a supporting sheet allowing the removal of the bond coat material, then removing the supporting sheet. The bond may include a thermally insulating film (TBC) on the bond coat. The base material may be formed as turbine engine components.


Inventors:
HASZ WAYNE CHARLES
BOROM MARCUS PRESTON
Application Number:
JP2000303212A
Publication Date:
July 03, 2001
Filing Date:
October 03, 2000
Export Citation:
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Assignee:
GEN ELECTRIC
International Classes:
B23K1/00; B23K35/02; C23C4/02; F02C7/00; C23C4/08; C23C4/10; C23C4/18; C23C16/48; C23C26/02; (IPC1-7): B23K1/00; C23C4/08; F02C7/00
Domestic Patent References:
JPH11152584A1999-06-08
Foreign References:
WO1999024647A11999-05-20
Attorney, Agent or Firm:
Kenichi Matsumoto