Title:
METHOD FOR FORMING POWDER SINGLE LAYER FILM LAMINATE
Document Type and Number:
Japanese Patent JP3668447
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a powder single layer film laminate excellent in scratch resistance and hard to stain.
SOLUTION: The powder single layer film laminate has the binder layer provided on a substrate and a powder single layer film comprising a large number of powdery particles embedded in the binder layer in a single-layered state so as to be partially protruded. The method for forming this laminate includes a process (1) for providing a coating layer containing a thermoplastic resin on at least one surface of the substrate, a process (2) for supplying an organic solvent to the surface of the coating layer to impart tack strength sufficient to bond the powdery particles, a process (3) for bonding the powdery particles to the surface of the coating layer to embed them in the coating layer and a process (4) for removing the excess powder particles present on the surface of the coating layer and also removing the organic solvent left on the coating layer to form the binder layer having the powder particles embedded therein. The formed binder layer has Tg of 60°C or higher or has no Tg.
Inventors:
East kensaku
Application Number:
JP2001280942A
Publication Date:
July 06, 2005
Filing Date:
September 17, 2001
Export Citation:
Assignee:
Tomagawa Paper Mill Co., Ltd.
International Classes:
B32B38/00; B32B5/16; B32B27/14; G02B5/02; (IPC1-7): G02B5/02; B32B27/14
Domestic Patent References:
| JP10268428A | ||||
| JP2001098386A |
Attorney, Agent or Firm:
Tsuyoshi Watanabe
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