Title:
METHOD FOR FORMING SOLDER REGION ON ELECTRONIC PART AND ELECTRONIC PART WITH SOLDER REGION
Document Type and Number:
Japanese Patent JP2005183904
Kind Code:
A
Abstract:
To provide a method for forming a solder region on an electronic part and the electronic part with the solder region.
A substrate 2 with one or a plurality of contact pads 4 is provided. Solder bumps 12' are formed by attaching solder paste 8 on the contact pads and melting and re-solidifying solder paste. Solder paste contains a carrier means and a metallic component with metallic particles. Solder paste has a solidus-line temperature lower than that generated after the melting of solder paste and the re-solidification of the melting.
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Inventors:
BRESE NATHANIEL E
TOBEN MICHAEL P
TOBEN MICHAEL P
Application Number:
JP2004096963A
Publication Date:
July 07, 2005
Filing Date:
March 29, 2004
Export Citation:
Assignee:
ROHM & HAAS ELECT MAT
International Classes:
H01L21/60; B23K3/06; B23K31/02; H05K3/00; H05K3/12; H05K3/34; H05K13/04; (IPC1-7): H01L21/60
Domestic Patent References:
| JP2000164531A | 2000-06-16 | |||
| JP2003059958A | 2003-02-28 |
Foreign References:
| WO2004103043A1 | 2004-11-25 |
Attorney, Agent or Firm:
Minoru Senda
Koji Hashimoto
Koji Hashimoto
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