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Title:
固体撮像素子レンズの形成方法
Document Type and Number:
Japanese Patent JP4641169
Kind Code:
B2
Abstract:

To provide a photosensitive resin composition for a solid-state image sensor lens for manufacturing a solid-state image sensor lens with high latitude in a form as well as following the optical design, and to provide a solid-state image sensor lens using the photosensitive resin composition, a method for manufacturing a solid-state image sensor lens by using the photosensitive resin composition for a solid-state image sensor lens, and a solid-state image image sensor having a solid-state image sensor lens.

The photosensitive resin composition for a solid-state image sensor lens is to be used in a method of forming a microlens using a photomask which controls the distribution of transmitted light quantity in exposure by a distribution state of fine patterns not resolved at the wavelength of exposure light for forming a microlens. The relation between the aperture ratio of the mask and the film remaining rate when the photosensitive resin composition is irradiated through the photomask with light in the saturation exposure light quantity of the film remaining rate shows that R2in linear approximation by a least squares method ranges from 0.950 to 1.000 in a range of 20% to 80% of the mask aperture ratio.

COPYRIGHT: (C)2006,JPO&NCIPI


Inventors:
Yoshino Maeno
Katsuya Sakayori
Kei Ikegami
Kei Sumita
Hideaki Kobayashi
Nobuto Climbing
Application Number:
JP2004287782A
Publication Date:
March 02, 2011
Filing Date:
September 30, 2004
Export Citation:
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Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
G02B1/04; C08K5/28; C08L101/12; G02B3/00; H01L27/14; H04N5/335; H04N5/369
Domestic Patent References:
JP2002311565A
Attorney, Agent or Firm:
Kishimoto Tatsuto
Akihiko Yamashita



 
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